TOKYO, Mar 4, 2026 - (JCN Newswire via SeaPRwire.com) - JCB Co., Ltd. (JCB), together with Resona Holdings, Inc. (Resona), announced the start of a project to commercialize ultra-wideband (UWB) payments that realize a new purchasing experience using UWB communication.The two companies have agreed to launch the world's first full-scale project for the practical application and commercialization of UWB payments. In 2026, JCB will work with multiple technology partners and collaborating merchants to demonstrate payment technology and value-added solutions for merchants, as well as user experience building projects to create new purchasing experiences. On top of that, JCB aims to launch small-scale commercial operations in 2027 and full-scale commercialization in earnest in 2028.The two companies are participating in the FiRa® Consortium, which standardizes and contributes to the development of UWB communication technology, as well as builds new payment experiences and value-added solutions for stores using UWB technology.About the UWB Payment ProjectThrough the activities of the FiRa Consortium, JCB, and Resona will standardize technologies and experiences for payment applications...

TOKYO, Mar 3, 2026 - (JCN Newswire via SeaPRwire.com) - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced a gold bump*1 transfer technology for the sintered gold (Au) bonding technology “AuRoFUSE™ Preforms.” This technology allows AuRoFUSE™ Preforms (gold bumps) to be formed even on semiconductor chips and substrates*2 with complex structures.Gold bump transfer substrate producedGold bumps after transferAdvantages of being able to transfer gold bumpsIn this technology, at first, gold bumps are formed on a substrate (transfer substrate). Then, the gold bumps are transferred to the target semiconductor chip or substrate. Openings are created on the silicon substrate used as the transfer substrate, and gold bumps are formed in them. By filling the entire opening, the gold bump is held by the substrate, eliminating the risk of dropping during the process. Meanwhile, during transfer, the gold bump shrinks under heat-treatment, forming a tiny gap between the opening and the gold bump. This allows...

Kawasaki, Japan and Barcelona, Spain, March 3, 2026 - (JCN Newswire via SeaPRwire.com) - Fujitsu and BCN Port Innovation Foundation today announced a new agreement between Fujitsu Spain and the BCN Port Innovation Foundation to develop a proof of concept (PoC) for an ocean digital twin at the Port of Barcelona. This pioneering initiative is aimed at the regeneration of the marine environment, the protection of biodiversity and the promotion of the blue economy(1).Catalina Grimalt, CEO and President, BCN Port Foundation (left) and Ángeles Delgado, President of Fujitsu Technology Solutions S.A. (right) shaking hands after the signing ceremony to kick off the proof of concept.The project is based on the use of underwater drones combined with artificial intelligence and advanced analytics, capable of capturing high-resolution representations of the seabed. Using this non-destructive sensing approach, the digital twin will make it possible to visualize and quantify biodiversity, calculate biomass based on vegetation cover, and estimate blue carbon(2) associated with marine algae.This project lays the foundations for the BCN Port Innovation Foundation to have a unified digital pla...