ACN Newswire
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TANAKA Starts Taking Orders for Gold Bonding Wires Using “RE Series” 100% Recycled Precious Metals

indie
5 minutes

TOKYO, Aug 30, 2022 - (ACN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, announced today that its subsidiary TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Toshiya Yamamoto), which is engaged in the production of various types of bonding wires, will start taking orders for gold (Au) bonding wires manufactured using only "RE Series" 100% recycled precious metals. This is in addition to existing products which use raw materials that include gold directly produced from mines.Gold bonding wiresA compound for plating solutions has already been launched as the first product to use the RE Series supplied by TANAKA Kikinzoku Kogyo as raw materials. As a secondary use, the RE Series is being expanded*1 to gold bonding wires manufactured by TANAKA Denshi Kogyo.Boasting the world's highest market share*2, TANAKA Denshi Kogyo's gold bonding wires support the world's semiconductor industry. A stable worldwide supply of the RE Series is possible as it is being produced at four locati...

JCN Newswire
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TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

ruth
4 minutes

TOKYO, Jan 12, 2022 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that its subsidiary, TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Shigeru Iseki), which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.Construction of this new plant forms part of TANAKA Denshi Kogyo's plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.Aluminum bonding wireTANAKA Denshi Kogyo has been producing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China, since 2001. With the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to ...

JCN Newswire
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TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

ruth
4 minutes

TOKYO, Jan 12, 2022 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that its subsidiary, TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Shigeru Iseki), which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.Aluminum bonding wireConstruction of this new plant forms part of TANAKA Denshi Kogyo's plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.TANAKA Denshi Kogyo has been producing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China, since 2001. With the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to ...

JCN Newswire
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Showa Denko Develops WelQuick(TM) to Bond Dissimilar Materials Quickly

ruth
4 minutes

TOKYO, Jun 28, 2021 - (JCN Newswire via SEAPRWire.com) - Showa Denko K.K. (SDK; TSE:4004) has developed "WelQuick(TM)," a film-type binding material to bond dissimilar materials together, such as bonding between resins and metals, with excellent quickness and strength. SDK has already started to provide potential customers with samples of WelQuick.Comparison of WelQuick(TM) bonding method and conventional bonding methodIn recent years, manufacturing industry's requirements for materials such as lightness, heat-resistance and strength have been advanced so much that almost no single material can meet such sophisticated needs. Therefore, there has been a progress in introduction of composite structure into components, in which dissimilar materials such as resins and metals are bound together. This movement is called "multi-materialization." There are many methods to bond dissimilar materials, such as bonding with liquid adhesives or hot-melt adhesives, and mechanical fastening with bolts. Though manufacturers demand simple, easy and timesaving bonding process while securing enough adhesive strength. However, simultaneous achievement of simplicity and adhesiveness has been difficult.W...