TOKYO, Jul 20, 2021 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) announced today that TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, developed an active brazing filler metal/copper composite material for power devices that can reduce processing times.The new product is a composite (cladding) of copper (Cu) material with active brazing filler metal on one side. Since it can be joined directly to any material including ceramics (oxides, nitrides, and carbides) and carbon materials, it is expected that it will be used in ceramic substrates and next-generation heat sinks for power devices. In addition, TANAKA can make various proposals tailored to customer needs ranging from supply of prototypes using this product to brazing[1] processes, testing, and evaluation.Product Features and New Processing Proposals: Both High Heat Dissipation and Processing Labor Savings PossibleImproved Performance- The thick Cu electrodes needed for high heat dissipation heat ...