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TANAKA Starts Taking Orders for Gold Bonding Wires Using “RE Series” 100% Recycled Precious Metals

TOKYO, Aug 30, 2022 - (ACN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, announced today that its subsidiary TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Toshiya Yamamoto), which is engaged in the production of various types of bonding wires, will start taking orders for gold (Au) bonding wires manufactured using only "RE Series" 100% recycled precious metals. This is in addition to existing products which use raw materials that include gold directly produced from mines.Gold bonding wiresA compound for plating solutions has already been launched as the first product to use the RE Series supplied by TANAKA Kikinzoku Kogyo as raw materials. As a secondary use, the RE Series is being expanded*1 to gold bonding wires manufactured by TANAKA Denshi Kogyo.Boasting the world's highest market share*2, TANAKA Denshi Kogyo's gold bonding wires support the world's semiconductor industry. A stable worldwide supply of the RE Series is possible as it is being produced at four locati...

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TANAKA to Establish New Building at Hukou Plant, Expanding Its Precious Metal Recycling Business in Taiwan

TOKYO, Jul 21, 2022 - (ACN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that it will establish a new building at the Hukou Plant in Hsinchu County, Taiwan.Expected appearance of the new building at Hukou PlantThe new building will be constructed with an investment of approximately 3.5 billion yen to create a "one-stop service" for precious metal recycling and further expand business in Taiwan. It is planned to have eight floors above ground and one basement floor, making the total floor area of the Hukou Plant approximately six times larger after completion. The plant is scheduled to begin operation in the first half of 2025.TANAKA Kikinzoku Kogyo expects to expand its recycling business in Taiwan by 2026 to provide a stable supply of precious metal materials and contribute to Taiwan's semiconductor industry, which has a large share of the entire semiconductor market.Taiwan TANAKA Kikinzoku Kogyo has been engaged in the precious metal recovery and refining business in Taiwan since the establishment of the Hukou Plant in 2005. TANAKA Kikinzoku Kogyo has decided to further ...

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TANAKA Launches “RE Series” Using 100% Recycled Precious Metals

TOKYO, Jun 8, 2022 - (ACN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, announced today the launch of its RE Series of recycled precious metals, which uses 100% recycled materials as the source of gold, platinum, and other precious metals.RE Series industrial-use product flowRE Series logoThe RE Series is composed of materials refined from recycled precious metals only rather than from sources such as mined bullion. TANAKA Kikinzoku Kogyo has been operating a recycled precious metals business since it was established. It has now expanded its RE Series production line to manufacture products that use 100% recycled precious metal materials. In the future, the company will begin manufacturing and supplying products that use RE Series materials. In April 2022, TANAKA began using RE Series gold to supply PGC-RE, a gold compound for plating, as its first product using RE Series materials.Through its RE Series, TANAKA Kikinzoku Kogyo hopes to continue contributing to the creation of the Sound Material-Cycle Society and to the r...

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TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

TOKYO, Jan 12, 2022 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that its subsidiary, TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Shigeru Iseki), which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.Construction of this new plant forms part of TANAKA Denshi Kogyo's plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.Aluminum bonding wireTANAKA Denshi Kogyo has been producing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China, since 2001. With the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to ...

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TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

TOKYO, Jan 12, 2022 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) has announced that its subsidiary, TANAKA Denshi Kogyo K.K. (Head office: Kanzaki-gun, Saga; Representative Director & President: Shigeru Iseki), which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.Aluminum bonding wireConstruction of this new plant forms part of TANAKA Denshi Kogyo's plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.TANAKA Denshi Kogyo has been producing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China, since 2001. With the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to ...

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TANAKA Contributes to Ambix Life Science Fund, a U.S. Medical Device Venture Fund

TOKYO, Sep 6, 2021 - (JCN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which is a subsidiary of TANAKA Holdings Co., Ltd. and operates the TANAKA Precious Metals manufacturing business, announced today that TANAKA made an equity contribution to Ambix Life Science Fund I, L.P., a medical device venture fund managed by Ambix Venture Management, LLC, a U.S.-based venture capital management company ("Ambix Ventures").Through this equity contribution, TANAKA will reinforce its overseas business development in addition to its domestic business development and contribute to the development of a safe and secure healthcare industry.Background to and Objectives of the ContributionTANAKA provides precious metal components and materials to medical device manufacturers and participates in development projects, cooperating with and contributing to development in the healthcare field. In addition, the company has made equity contributions to multiple medical device venture funds in the past and made the decision at this time to make a contribution to the venture fund of Ambix Ventures, which is base...

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TANAKA Develops Active Brazing Filler Metal/Copper Composite Material for Power Devices

TOKYO, Jul 20, 2021 - (JCN Newswire via SEAPRWire.com) - TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) announced today that TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, developed an active brazing filler metal/copper composite material for power devices that can reduce processing times.The new product is a composite (cladding) of copper (Cu) material with active brazing filler metal on one side. Since it can be joined directly to any material including ceramics (oxides, nitrides, and carbides) and carbon materials, it is expected that it will be used in ceramic substrates and next-generation heat sinks for power devices. In addition, TANAKA can make various proposals tailored to customer needs ranging from supply of prototypes using this product to brazing[1] processes, testing, and evaluation.Product Features and New Processing Proposals: Both High Heat Dissipation and Processing Labor Savings PossibleImproved Performance- The thick Cu electrodes needed for high heat dissipation heat ...